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'[EE] SMD soldering in toaster ovens.'
2002\11\20@133958
by
Wagner Lipnharski
|
Alexandre Guimarães wrote:
{Quote hidden}> Hi,
>
> Sorry for taking so long to get into the thread but I was far
> behind on the list messages...
>
> Please be carefull when opening the oven door or putting a fan to
> cool the boards faster ! Be very carefull.... All the manufacturers
> specifications call for a maximun temperature gradient also on the
> colling ramp and opening the oven door above 70 dg celsius will
> stress the components ! That is specially true for SMD multilayer
> capacitors, they will make micro-cracks with big temperature changes.
>
> The oven method is great for prototyping without precision
> temperature control but if anyone is thinking about using it, as I
> already do, for small production runs I strongly recommend using
> proper temperature control for both the heating and colling ramps. I
> ran a temperature profiler in my setup and I am sure I am not
> violating the component manufacturers specs on the temperature and I
> am quite sure it is not possible to be sure about it in a setup
> without a temperature controller or with an open oven door !
>
> My oven makes the soldering in about 6 minutes and cools in 2 more
> minutes. If you need faster than that use 2 ovens !
>
> Best regards,
> Alexandre Guimaraes
Alexandre, your above comments are very important, probably everybody is
just overseen it.
Doing experiments, I noticed that the profile temperature is not critical
for the soldering quality.
__
____/ \
/ | |\
_______/ | | \
/ | | | \____ 100°F
_____/ _ _ _ _|_ _ _|__|__ | _ _
A B C D
|________|_____|__|___|
A = PREHEAT 240 sec
B = MELT 120 sec
C = SOLDERING 45 sec
D = COOL OFF 60 sec
I made different tests basically changing temperature first;
A = 180°F, 200°F, 220°F
B = 300°F, 320°F, 340°F
C = 400°F, 420°F, 450°F
In any case, any combination, soldering was good, with few bridges.
I guess above 400°F the paste melts and soldering happens, no matter what.
Probably a better solder paste could reduce the bridges (any
recommendations?).
I also guess the temperature profile is more to protect the components than
produce a good soldering.
Alexandre, the above profile temp is adequate? can you comment or point
some errors?
Thank you.
Wagner.
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2002\11\20@183610
by
lexandre_Guimar=E3es?=
|
Hi,
> Alexandre, your above comments are very important, probably everybody is
> just overseen it.
It is quite easy to eversee it, specially because the cracks are not
visible most of the times.
> Doing experiments, I noticed that the profile temperature is not critical
> for the soldering quality.
Yes it does ! It is just not visible.. The paste needs the right time at
preheat to activate the flux and to evaporate the acids with no-clean flux.
The liquid solder wetting is too fast the solder bellow will not work well,
it it is too slow it will oxidize. There are some other problems with
specific components that make changes in the profile mandatory. You should
always check with the manufacturers datasheets to see if you are inside the
right specifications. Follows some points that I sent to Roman quite a while
ago offlist that are important by what I saw in some manufacturers
specifications and also in private talks with people from the soldering
industry:
Some points that I think are worth and that should save you from some
trouble:
- Look for a 800 watts infrared oven, smaller than that you might have
problems on the heating ramps. If you can find a forced air convection oven
the results should be better because of better heat distribution. I did not
find any ones down here, so I have not tried it myself.
- Use solder paste with silver on it. The price is a little higher but some
capacitors will not solder nicely with a common pb/sn solder. I use Kester
solder paste. It is R276 if I remember right..
- Try many different profiles to see the one that works best on the board
you are manufacturing. Each board is a different reality because of the
different components density and IR absorption rates.
- The solder should stay at the liquid state for more than 45 seconds and
less than 90 seconds. Less time will make a bad solder joint and too much
time will burn the components and possibly make a solder joint that has an
intermetalic connection that is too thick and will be easily breakable by
vibration and it will oxidize.
- If you have compressed air use it with an eletro-pneumatic valve and
electronics time control to make a dispensing unit that puts the right
quantity of solder paste on the pads.
> In any case, any combination, soldering was good, with few bridges.
> I guess above 400°F the paste melts and soldering happens, no matter what.
Like I said before it does matter but maybe not visible :-( Sometimes an
xray inspections reveals voids and if the flux has not been correctly
activated and evaporated it may leave acid residues on the board and inside
the solder ball !
> Probably a better solder paste could reduce the bridges (any
> recommendations?).
The right temperature with the right solder will reduce the problem. I
use Kester R276 with 2% of silver. No bridges at all !!
> I also guess the temperature profile is more to protect the components
than
> produce a good soldering.
It serves both purposes. Here is a link to the profile I used as a basis
for my experiments. In practice I use a much longer preheat and flux
activation phase because I prefer to be conservative on that. You will have
to experiment because it really varies with the oven size and power and also
from board to board. Depending on the board components density you may have
to change it around. With a forced air convection oven you may be able to
use just one profile but I have not tried that out. I also helps a lot to
make your board as equally dense with components as possible. Remember that
if a region has too many or too few components it will not heat or cool as
the other regions of the board.
http://www.iis.com.br/~alexg/profile.bmp
If you have any more questions fell free to ask..
Best regards,
Alexandre Guimaraes
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2002\11\20@184312
by
Philip Pemberton
2002\11\20@191649
by
Peter Homann
2002\11\20@193813
by
Paul Gaastra
This oven talk is interesting.
If it's so critical to get the profiles right using an oven, how come I seem to be able to hand solder SMD's with a great deal of butchery and still get working boards? (I have had one or two 1uF caps go crack on me though)
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2002\11\20@203431
by
lexandre_Guimar=E3es?=
|
Hi,
> This oven talk is interesting.
>
> If it's so critical to get the profiles right using an oven, how come I
seem to be able to hand solder SMD's with a great deal of butchery and still
get working boards? (I have had one or two 1uF caps go crack on me though)
It is not too critical, it is just a little critical :-)
If you think better about it you will see that hand soldering produces
less stress because it is much more localized and it takes much less time to
make the solder joints ! My oven cycle takes 8 minutes and your hand
soldering less than 10 seconds. It is the same problem that you have when
using SOIC components in the oven process. You have to "bake" them for a
while at 50 celsius to make sure you do not have any humidity inside the
packages or they will crack in the oven. With hand soldering that is not
necessary at all..
Getting the right profile done is quite easy and I got it working myself
in few days, you just have to know what to look for and read all the
manufacturers specs to make sure you are not violating the specs. A toaster
oven with the right temperature control can give you a better profile than a
cheap 3 zones conveyor oven !!! You just have to look at it carefully.
Best regards,
Alexandre Guimaraes
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2002\11\20@203846
by
lexandre_Guimar=E3es?=
Hi, Philip
> While we're on the subject of SMD soldering, has anyone tried soldering
BGAs
> with either a heatgun or a toaster oven?
> Just wondering...
Not BGA's but I have soldered small adxl202 acelerometers that come in
those weird ceramic packages and have pads bellow the surface.
In my opnion BGA's would be too much for a small oven, even the big ones
have trouble with them sometimes. I would not try smaller than 0805 and 0.50
pitch. When I need that kind of components you can afford a full size reflow
oven ;=)
Best regards,
Alexandre Guimaraes
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2002\11\20@231337
by
Josh Koffman
Best bet is to register as a member at http://www.piclist.com (not the
same as being a member of the PICList). Then you are entitled to free
webspace. You can then post the link here. You may also be able to get
James (the webmaster) to start a section about assembling SMT, if one
doesn't exist already.
Josh
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-Douglas Adams
Peter Homann wrote:
> I have a PDF file that contains a description, circuit and software of a SMT
> toaster oven I built. I'd like to upload for public consumption. I can't see
> how to upload a PDF file to the PICLIST archive.
>
> Can somebody help with instructions on how to do this or provide me with a
> way to upload the file.
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2002\11\21@030206
by
Roman Black
|
Alexandre Guimarces wrote:
> Please be carefull when opening the oven door or putting a fan to cool
> the boards faster ! Be very carefull.... All the manufacturers
> specifications call for a maximun temperature gradient also on the colling
> ramp and opening the oven door above 70 dg celsius will stress the
> components ! That is specially true for SMD multilayer capacitors, they will
> make micro-cracks with big temperature changes.
Alexandre is correct, I apologise for suggesting
that just opening the door after soldering is a
good way to do it. In reality our needs were quite
different, ie only soldering a few SMD chips and
no other components, and it wasn't "instantly"
opening the door as it may have sounded. I posted
that system in reply to someone who suggested it
was difficult to do SMD in a cheap oven, and the
main point I was trying to make was that it's not
really difficult and no expensive controllers
are needed.
At the time we were using this simple stopwatch
method I tested the system time over temperature
and the different phases, ie oven preheat, on full,
turn off, and door open, gave temperature in
each phase that was close enough to the proper
times and temperature ramps that it worked quite
ok.
If we had to solder the small parts (or larger
areas of the PCB than just 1.5 square inches)
I would go with the proper temp controller system
as Alexandre has suggested. :o)
-Roman
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2002\11\21@034809
by
Alan B. Pearce
>Probably a better solder paste could reduce the bridges
>(any recommendations?).
Probably a little less paste, so it tends to pull back better due to surface
tension and capillary action between the pad and pin. If you look at
commercial SMD soldering, you will see that there really is very little
solder on each pin, just enough to produce the nice meniscus between the pin
and pad. If you have enough to allow the solder to bulge over the pad then
you have too much.
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2002\11\21@041122
by
Roman Black
Alan B. Pearce wrote:
>
> >Probably a better solder paste could reduce the bridges
> >(any recommendations?).
>
> Probably a little less paste, so it tends to pull back better due to surface
> tension and capillary action between the pad and pin. If you look at
> commercial SMD soldering, you will see that there really is very little
> solder on each pin, just enough to produce the nice meniscus between the pin
> and pad. If you have enough to allow the solder to bulge over the pad then
> you have too much.
Also putting the line of paste closer to the
end of the chip pins, (not close to the body)
seems to help too. When they bridge it's mainly
up against the chip body.
-Roman
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2002\11\21@044854
by
Florian Voelzke
2002\11\21@101025
by
Katinka Mills
|
> -----Original Message-----
> From: pic microcontroller discussion list
> [KILLspamPICLISTKILLspam
MITVMA.MIT.EDU]On Behalf Of Florian Voelzke
> Sent: Thursday, 21 November 2002 5:48 PM
> To: RemoveMEPICLISTTakeThisOuT
MITVMA.MIT.EDU
> Subject: Re: [EE] SMD soldering in toaster ovens.
>
>
Ohhhhhh Noooooooooo It is pulling me under .......
Ok when I have a few $$ Spare, I will be going out and buying a Toaster
Oven, Fan Forces, with Top and Bottom Elements... Voiding the waranty,
Ripping the Guts out .... Building a uC interface with RS 232 output so I
can data log the boards.... This sucker will be mean it will be a fighting
machine ....... I will use an old Microwave front Panel with membrane keypad
and Multi segment Vacume Flourecent Display..... This will be the .... V8
Super SMD soldering oven.....
Tim Allen ;o) arrff arrff arrff
;o)
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2002\11\21@163305
by
Wagner Lipnharski
Katinka Mills wrote:
> Ohhhhhh Noooooooooo It is pulling me under .......
>
> Ok when I have a few $$ Spare, I will be going out and buying a
> Toaster Oven, Fan Forces, with Top and Bottom Elements... Voiding the
> waranty, Ripping the Guts out .... Building a uC interface with RS
> 232 output so I can data log the boards.... This sucker will be mean
> it will be a fighting machine ....... I will use an old Microwave
> front Panel with membrane keypad and Multi segment Vacume Flourecent
> Display..... This will be the .... V8 Super SMD soldering oven.....
$29 at Target.
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2002\11\21@171917
by
Peter Homann
2002\11\21@175523
by
steve
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